General Information
  • Design provides low cost, highly reliable interconnection
  • Ideal for mother/ daughter board interconnections
  • Mates with both .025 square or round pins
  • Vertical or horizontal configurations
  • Single or double row

Features
  • Surface mount and solder tail configurations
  • Designed for use with double-sided and multilayered PCB's
  • High-temp, plastic allows infra-red and vapor phase soldering
  • .145 ± .006 point-of-normal-force contact
  • Low insertion force design
  • BeCu contacts
  • Selective gold plating
  • Standoffs
  • Packaging for robotic assembly available

Technical Data
  • Current rating = 3 amp (maximum)
  • Dielectric withstanding voltage = 1000 VAC RMS (minimum)
  • Insulation resistance = 10,000 megohms (minimum)
  • Contact resistance = 30 milliohms (maximum)
  • Contact retention = 2 lbs. (minimum)
  • Durability = 200 mating cycles (minimum)
  • Temperature ranges = -65ºC to +125ºC
  • Mating force: = 4 oz./contact (maximum)
Test Data
  • Specifications, prints and samples are available upon request from Teka Customer Service.

Click links below for Product Quick View

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